International Bid Contractor
| Bid Title | Country |
|---|---|
| Summary | |
| Bid Date | |
| State of the Art Trusted Foundry Services | ![]() USA |
| ...ensure mission-critical national defense systems can obtain classified (up to ...for design, aggregation, mask manufacturing, wafer fabrication, post-processing, packaging/assembly, test, and broker ...demand, a minimum of approximately 1200 wafers | |
| Posted Date: Apr 24, 2012 Bid Date: Apr 27, 2012 | |
| TECHNOLOGY/BUSINESS OPPORTUNITY Stabilized Slurry Material | ![]() USA |
| ...and can prevent further slurry processing, such as filtration. In addition, ...high energy laser or optical systems; as well as general manufacturing ...general manufacturing of optics and wafers. Development Status: LLNL | |
| Posted Date: Apr 04, 2012 Bid Date: May 04, 2012 | |
| State of the Art Trusted Foundry Services | ![]() USA |
| ...ensure mission-critical national defense systems can obtain classified (up to ...for design, aggregation, mask manufacturing, wafer fabrication, post-processing, packaging/assembly, test, and broker ...demand, a minimum of approximately 1200 wafers | |
| Posted Date: Apr 03, 2012 Bid Date: Apr 27, 2012 | |
| State of the Art Trusted Foundry Services | ![]() USA |
| ...ensure mission-critical national defense systems can obtain classified (up to ...for design, aggregation, mask manufacturing, wafer fabrication, post-processing, packaging/assembly, test, and broker ...demand, a minimum of approximately 1200 wafers | |
| Posted Date: Mar 27, 2012 Bid Date: Apr 27, 2012 | |
| MJB3 MASK ALIGNER | ![]() USA |
| ...equal, consisting of: MJB3 Main System - Capable of processing 1mm pieces up to 3-inch ...1mm pieces up to 3-inch wafers; Configured for Top Side Alignment (...0002-AA: 1 Lot 1 each, KINETIC SYSTEMS | |
| Posted Date: Jan 10, 2012 Bid Date: Jan 24, 2012 | |
| Trusted Integrated Chips (TIC) Program Broad Agency Announcement | ![]() USA |
| ...the Moore's Law of digital processing and storage integrated circuits, this ...components to provide high value systems such as sensors, actuators, and ...BEOL via dedicated Multi-Project Wafer (MPW) fabrication runs | |
| Posted Date: Dec 01, 2011 Bid Date: Dec 13, 2011 | |
| Trusted Integrated Chips (TIC) Program Broad Agency Announcement | ![]() USA |
| ...the Moore's Law of digital processing and storage integrated circuits, this ...components to provide high value systems such as sensors, actuators, and ...BEOL via dedicated Multi-Project Wafer (MPW) fabrication runs | |
| Posted Date: Oct 26, 2011 Bid Date: Dec 13, 2011 | |
| FI-Oulu: laboratory, optical and precision equipments (excl. glasses) | ![]() Finland |
| ...competitive dialogue and a dynamic purchasing system) can be obtained at: As ...Earlier experience of UV imprinting processing at MicroModule Centre, a VTT office ...Finland, has been gathered with wafer-level | |
| Posted Date: Sep 16, 2011 Bid Date: Nov 01, 2011 | |
| Atomic Force Microscope / Scanning Probe Microscopy System | ![]() USA |
| ...associated North American Industrial Classification System (NAICS) code for this procurement ...interconnected with wiring on the wafer. BEOL generally begins when the ...be capable of applying and processing microwave frequency radiation | |
| Posted Date: Sep 01, 2011 Bid Date: Sep 12, 2011 | |
| Notice of Intent to Sole Source: Atomic Force Microscopy/Scanning Probe Microscopy (AFM/SPM) System | ![]() USA |
| ...scanning probe microscopy (AFM/SPM) system under other than full and ...as capable of applying and processing microwave frequency radiation throughout its ...BEOL processes, such as through wafer vias, buried metal | |
| Posted Date: Aug 25, 2011 Bid Date: Jun 09, 2011 | |
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