Result(s) for Ic Device: OnBid

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Search Result(s) for Ic Device

174 Opportunities Found 1 2 3 4 5 Next

Bid Title	Country
Summary	Country
Bid Date
Shipboard Multipurpose Copier Program (SMCP)	USA
...the acquisition of Multi-Functional Devices (MFDs with the capacity to ...The SMCP requires Class I, Class IC, II, III, IIIC, IV, MFDs ...Warranty support and maintenance agreements Device removal at the	USA
Posted Date: May 22, 2012 Bid Date: May 21, 2012
Shipboard Multipurpose Copier Program (SMCP)	USA
...the acquisition of Multi-Functional Devices (MFDs with the capacity to ...The SMCP requires Class I, Class IC, II, III, IIIC, IV, MFDs ...Warranty support and maintenance agreements Device removal at the	USA
Posted Date: May 11, 2012 Bid Date: May 21, 2012
Focus Center Research Program (FCRP) Research Announcement	USA
...systems. This historical advance in IC and related systems technologies resulted ...the parts." 1. High performance analog devices for high speed wireless, THz	USA
Posted Date: Apr 27, 2012 Bid Date: Sep 14, 2012
State of the Art Trusted Foundry Services	USA
...and integrity of specialized military devices) has become increasingly challenging owing ...globalization of the integrated circuit (IC) industry. The DoD Trusted Foundry	USA
Posted Date: Apr 24, 2012 Bid Date: Apr 27, 2012
Latent Print Support Services	USA
...three sections are: a) Terrorist Explosive Device Analytical Center (TEDAC), b) Biometric Analysis ...Lynda M. Theisen at Lynda.Theisen@ic.fbi.gov or by fax	USA
Posted Date: Apr 23, 2012 Bid Date: Apr 30, 2012
Focused Center Research Program (FCRP) Research Announcement	USA
...systems. This historical advance in IC and related systems technologies resulted ...the parts." 1. High performance analog devices for high speed wireless, THz	USA
Posted Date: Apr 23, 2012 Bid Date: Sep 14, 2012
Shipboard Multipurpose Copier Program (SMCP)	USA
...the acquisition of Multi-Functional Devices (MFDs with the capacity to ...The SMCP requires Class I, Class IC, II, III, IIIC, IV, MFDs ...Warranty support and maintenance agreements Device removal at the	USA
Posted Date: Apr 18, 2012 Bid Date: May 21, 2012
Latent Print Support Services	USA
...three sections are: a) Terrorist Explosive Device Analytical Center (TEDAC), b) Biometric Analysis ...Lynda M. Theisen at Lynda.Theisen@ic.fbi.gov or by fax	USA
Posted Date: Apr 16, 2012 Bid Date: Apr 30, 2012
Latent Print Support Services	USA
...three sections are: a) Terrorist Explosive Device Analytical Center (TEDAC), b) Biometric Analysis ...Lynda M. Theisen at Lynda.Theisen@ic.fbi.gov or by fax	USA
Posted Date: Apr 13, 2012 Bid Date: Apr 30, 2012
ELECTROMETER/RADIOLOGICAL EQUIPMENT	USA
...Phantom, cavity for 0.6cc Farmer IC with BU Cap, Part# 665-...CLIN 0030 Breast Compression Test Device, Part# 163 QTY: 1 Unit of	USA
Posted Date: Apr 11, 2012 Bid Date: Apr 11, 2009